一. What is sinking gold?
Simply put, immersion gold is the use of chemical deposition methods to produce a layer of metal coating on the surface of circuit boards through chemical oxidation-reduction reactions.
二. Why sink gold?
The copper on the circuit board is mainly red copper, and the copper solder joints are easily oxidized in the air, which will cause poor conductivity, that is, poor tin intake or poor contact, and reduce the performance of the circuit board.
Then it is necessary to carry out surface treatment on copper solder joints. Immersion gold is to plate gold on it. Gold can effectively block copper metal and air to prevent oxidation. Therefore, immersion gold is a treatment method for surface anti-oxidation. The surface is covered with a layer of gold, also known as Huajin.
三. What are the benefits of immersion gold surface treatment?
The advantage of the immersion gold process is that the deposited color on the surface is very stable when the circuit is printed, the brightness is very good, the coating is very smooth, and the solderability is very good.
The thickness of immersion gold is generally 1-3Uinch, so the thickness of gold produced by the surface treatment method of immersion gold is generally thicker, so the surface treatment method of immersion gold is generally used in key boards, gold finger boards and other circuit boards, because Gold has strong electrical conductivity, good oxidation resistance and long service life.
四. What are the benefits of circuit boards using immersion gold boards?
There are mainly the following points:
1. The immersion gold plate is bright in color, good in color and luster, and looks good.
2. The crystal structure formed by immersion gold is easier to weld than other surface treatments, and can have better performance and ensure quality.
3. Because the immersion gold board only has nickel gold on the pad, it will not affect the signal, because the signal transmission in the skin effect is on the copper layer.
4. The metal properties of gold are relatively stable, the crystal structure is denser, and oxidation reaction is not easy to occur.
5. Because the immersion gold board only has nickel gold on the pad, the combination of the solder resist on the circuit and the copper layer is stronger, and it is not easy to cause a micro-short circuit.
6. The project will not affect the spacing when making compensation.
7. The stress of the immersion gold plate is easier to control.
五. Immersion Gold and Gold Finger
Gold finger, let's put it bluntly, is a brass contact, which can also be said to be a conductor.
In detail, because gold has strong oxidation resistance and strong conductivity, the parts connected to the memory slot on the memory stick are plated with gold, and all signals are transmitted through the gold fingers.
Because the golden finger is composed of many yellow conductive contacts, its surface is gold-plated and the conductive contacts are arranged like fingers, hence the name.
Generally speaking, the gold finger is the connection part between the memory stick and the memory slot, and all signals are transmitted through the gold finger. The gold finger is composed of many golden conductive contacts. The gold finger is actually covered with a layer of gold on the copper clad laminate through a special process.
Therefore, the simple distinction is that immersion gold is a surface treatment process of circuit boards, and gold fingers are components on circuit boards that have signal connections and conduction.
