Many special components are often used in PCB layout. Once the layout is not handled properly, it will directly affect the performance and quality of the PCB circuit board. So, what are the layout requirements for special components on PCB circuit boards?
1. Layout requirements for crimping devices
(1) There must be no components higher than 3mm within 3mm around the surface of the crimping device, and there must be no soldering devices around 1.5mm; there must be no components within 2.5mm from the center of the pin hole of the crimping device on the revers side of the crimping device. device.
(2) There must be no components within 1mm around the crimping device.
2. Layout requirements for thermal devices
(1) Heat-sensitive devices (such as electrolytic capacitors, crystal oscillators, etc.) should be kept away from high-heat devices as much as possible.
(2) The heat-sensitive device should be close to the component under test and kept away from high-temperature areas, so as not to be affected by other heat-generating equivalent components.
(3) Place the self-heating and heat-resistant devices near the air outlet or on the top, and try to stagger their positions with other heat-generating devices and heat-sensitive devices in the upward direction of the air.
3. Layout requirements for devices with polarity
(1) THD devices with polarity or directionality are in the same direction in the layout and arranged neatly.
(2) The direction of the polarized SMC on the board is as consistent as possible; the devices of the same type are arranged neatly and beautifully.
4. Layout requirements for through-hole reflow soldering devices
(1) For PCBs with a non-transmitting side size greater than 300mm, try not to place heavier components in the middle of the PCB.
(2) For the convenience of plug-in, the device is arranged near the side of the plug-in operation.
(3) The length direction of the longer device is consistent with the conveying direction.
(4) The distance between the edge of the through-hole reflow soldering device pad and other SMT devices is >2mm.
(5) The distance between the through-hole reflow soldering device bodies is >10mm.
(6) The distance between the edge of the through-hole reflow soldering device pad and the transmission side is ≥ 10mm; the distance from the non-transmission side is ≥ 5mm,
The above are the layout requirements of the special components of the PCB circuit board, and I hope to help you.
