What is PCB immersion gold board
The so-called PCB immersion gold processing technology refers to the formation of a layer of coating according to the method of chemical oxidation and reduction, which is usually thicker and thicker. It is a type of precipitation method of chemical nickel, gold and gold layers, and a thicker gold layer can be achieved.
[Eight-layer immersion gold circuit board]
What is PCB gold plated board
PCB gold plating is also called "electroplating gold", "electroplating nickel gold plate", "electrolytic gold", "electric gold" and "electric nickel gold plate". Electroplating gold is divided into soft gold and hard gold. Hard gold is used for gold finger PCB circuit Board products, the basic principle is to melt nickel and gold (alias gold salt) in chemical potion, immerse the PCB circuit board in the electroplating process tank and connect the working current to form a nickel-gold plating layer on the surface of the copper foil of the pcb circuit board, electroplating Nickel gold is more resistant to wear due to the higher hardness of the coating.
What is the difference between PCB immersion gold and electroplating gold?
1. The gold thickness of immersion gold is thicker than that of electroplating gold. The surface of immersion gold is more golden yellow than that of electroplating gold. From the perspective of board surface, immersion gold can satisfy customers more.
2. The crystal structure caused by immersion gold and electroplating gold is not the same. Compared with electroplating gold, immersion gold is easier to weld, and it is not easy to cause poor welding during the welding process. In addition, immersion gold is softer than electroplating gold, making gold finger circuits The weight board is usually electroplated gold, and the hard gold has stronger wear resistance.
3. Compared with electroplating gold, immersion gold has a denser crystal structure and is not easily oxidized.
4. As the wiring of high-precision products becomes more and more precise, some line distances and intervals have been as low as 3mil, and the electroplating process of high-precision boards is likely to cause short-circuit failures of gold wires. The immersion gold board only has nickel gold on the solder layer, and there will be no problem of short circuit failure of the gold wire. And the solder mask on the line is more firmly combined with the copper layer, and the project will easily have any negative impact on the spacing when doing material compensation.
5. For high-frequency boards with relatively high demand, the immersion gold board should also have good flatness, and there will be no black pad problem after assembly. More importantly, the leveling property and service life of the immersion gold plate are better than that of the gold-plated plate.
