PCB double-sided circuit board tin plate / immersion gold plate production process:
Cutting--...-Drilling--Immersion Copper--Line--Picture Electricity--Etching--Solder Resist--Characters--Halray Tin (or Immersion Gold)-gong Edge ─ V cutting (some boards do not need) --- flying probe test --- vacuum packaging
PCB double-sided circuit board gold-plated board production process:
Cutting-----Drilling-----Immersion Copper----Line----Picture Electric---Gold Plating----Etching---Solder Mask----Character---- -Beveling---v cutting---flying probe test---vacuum packaging multi-layer circuit board tin board/immersion gold board production process:
Cutting-----Inner Layer--Lamination--Drilling---Immersion Copper--Line---Picture Electricity---Etching----Solder Mask---Character-- --HASL (or immersion gold)-gong edge─v-cutting (some boards don't need it)-----flying test--vacuum packaging
Multi-layer circuit board gold-plated board production process:
Cutting----inner layer----lamination----drilling---immersion copper----circuit---diagram electric---gold-plating----etching--solder mask ----characters-----gong edge---v cutting---flying test---vacuum packaging
