Multilayer circuit boards are formed by laminating and bonding several etched single-sided or double-sided boards. Then, compared with single-layer and double-layer circuit boards, what are the characteristics of multi-layer circuit boards? You share it together.
1. The multi-layer circuit board has high assembly density and small volume.
2. The multi-layer circuit board is convenient for wiring, the wiring length and the connection between components are shortened, which is conducive to improving the speed of signal transmission.
3. For high-frequency circuits, after adding the ground layer, the signal line forms a constant low impedance to the ground layer, the circuit impedance is greatly reduced, and the shielding effect is better.
4. For electronic products with high heat dissipation requirements, multilayer circuit boards can be equipped with metal core heat dissipation layers to meet the needs of special functions such as shielding and heat dissipation.
5. In terms of performance, multi-layer circuit boards are better than single- and double-sided boards, but the higher the number of layers, the higher the production cost, the longer the processing time, and the more complicated quality inspection.
6. Four- and six-layer boards are commonly used in multi-layer circuit boards. The difference between four-layer boards and six-layer boards is that there are two more internal signal layers between the middle layer, ground layer and power layer. Six-layer boards are more The four-layer board should be thicker.
Generally speaking, multilayer circuit boards have been widely used in the production and manufacture of electronic products because of their design flexibility, economical advantages, and stable and reliable electrical performance.
