1. When making PCB boards in the circuit board factory, one of the processes requires the use of dry film and wet film. In fact, the function of dry film and wet film is basically similar, but if the surface is not smooth or it is not necessary to build a thicker height Or very thin film thickness and other conditions; circuit board manufacturers can consider using wet film. If it is a circuit board with holes, dry film will be more suitable. And if the environment is not easy to keep clean, dry film is also easier to control the quality of operation. Although wet film materials are cheaper; they are not available everywhere. In addition to general considerations in use, it should still be considered in accordance with the manufacturer's own operating environment requirements.
2. The dry film is easy to operate, but the unit price is slightly higher than that of the wet film. But because it is easy to keep clean, and it does not need to be baked and has better workability, it is more advantageous to use. However, it is not easy to achieve thinner film thickness, especially dry film thickness below 15um. In addition, the better filling ability of the wet film is its advantage, but because there is no protective film, it needs higher exposure energy. Different views have different advantages and disadvantages. This must be compared by the user to obtain a more suitable one. in conclusion.
3. At present, the so-called wet film is almost always used in the soldering paint. As for the application of the inner board, the proportion of the wet film is getting higher and higher. This is because of the low cost and the gradual improvement of technology maturity. for the sake. But the two are in the production of inner circuit boards.
