The production method of multilayer circuit board is generally to make the inner layer graphics first, and then make a single-sided or double-sided substrate by printing and etching method, and put it into the specified layer, and then heat, press and bond it. Drilling is the same as the plated through hole method for double-sided boards. These basic manufacturing methods have not changed much from the methods dating back to the 1960s; however, as the materials and process technologies become more mature, the characteristics attached to multilayer boards are more diverse.
Advantages of multilayer circuit boards:
1. It can form a high-speed transmission circuit, easy to install and high in reliability;
2 High assembly density, small size and light weight;
3. The number of wiring layers can be increased, thereby increasing the design flexibility;
4. Can form a circuit with a certain impedance;
5. Due to the high assembly density, the connection between each component (including components) is reduced, thus improving the reliability;
6. The circuit and magnetic circuit shielding layer can be set, and the metal core heat dissipation layer can also be set to meet the needs of special functions such as shielding and heat dissipation.
Multilayer printed circuit refers to a printed circuit board made of more than three layers of conductive pattern layers separated by layers of insulating material, laminated and glued. The conductive patterns between the layers are interconnected as required. At present, multilayer circuit boards have been widely used in various electronic devices and become an important part of electronic components.
